The trademark application Avonisys Transparent Metal was filed by Avonisys AG, a corporation established under the laws of the Swiss Confederation (the "Applicant"). The application was published for oppositions on November 18, 2020, and it was registered by office on February 25, 2021 without any oppositions.
The application was filed in German (English was selected as the second language).
Goods And Services
The mark was filed in class 6 with Molds of metal.
The mark was filed in class 7 with following description of goods:
Laser machines and mechanical laser equipment and systems constructed therefrom for processing metals, glass, industrial ceramics, diamonds, synthetic diamonds, semiconductor wafers, LED substrates, composites and other materials
Cutting and milling systems having laser machines and laser systems
Surface and interior engraving systems having laser machines and laser systems
Stamping and embossing systems having laser machines and laser systems
Moulds for injection moulding tools
Moulds for die-casting [parts of machines]
Machines for the manufacture of moulds
Moulds for moulding plastics products [parts of machines]
Nozzles, In particular injectors for engines.
The mark was filed in class 9 with following description of goods:
Lasers, not for medical purposes
Short and ultrashort pulse lasers, not for medical purposes
Wafers, in particular silicon and silicon carbide and/or ceramic wafers and components, in particular of non-oxide ceramic materials.
The mark was filed in class 11 with Filters for industrial installations and Filters for industrial and household use..
The mark was filed in class 40 with following description of goods:
Processing of metals, glass, industrial ceramics, diamonds, synthetic diamonds, semiconductor wafers, LED substrates, composites and other materials using laser beams, laser machines and laser systems
Millworking, engraving, cutting, soldering, embossing and stamping using laser beams, laser machines and laser systems
Cloth cutting
Machining of materials
Cutting and drilling by means of ablation
Surface ablation using laser machines and laser systems.