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EUTM file information

018527056

HSP

August 3, 2021

Trademark Summary

The trademark HSP was filed by TAIYO HOLDINGS CO., LTD., a corporation established under the laws of Japan (the "Applicant"). The application was published for oppositions on September 7, 2021, and received one opposition filed on December 7, 2021 by Bundesdruckerei GmbH on Likelihood of confusion. the opponent was represented by BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB - PATENTANWÄLTE RECHTSANWÄLTE and proceedings were handled in English, and the oppositon was dismissed by the Euorpean Union Intellectual Property Office with decision issued December 7, 2021

The application was filed in English, and English was also language of all opposition proceedings (Italian was selected as the second language).

Goods And Services

  • The mark was filed in class 1 with following description of goods:
    1. Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask
    2. Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists
    3. Chemicals for use in the process of producing printed circuit boards, namely, solder resists
    4. Chemical preparations for use in the process of producing printed circuit boards, namely, solder mask
    5. Etching resist
    6. Photoresists
    7. Chemical preparations for use in photography
    8. Photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards
    9. Photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards
    10. Dry films for electronic components
    11. Photosensitive resists in the form of film for sealing electronic components
    12. Insulation dry films for electronic components
    13. Thermal curing type dry films for electronic components
    14. Chemical preparations for blocking light
    15. Chemical coatings for use in the process of producing printed circuit boards
    16. Heat resisting materials
    17. Chemical preparations for industrial purposes
    18. Industrial chemicals
    19. Glue and adhesives for industrial purposes
    20. Thermal interface materials for electronic components
    21. All aforementioned goods not for use as security features in identity and security documents.
  • The mark was filed in class 2 with following description of goods:
    1. Dyes
    2. Pigments
    3. Paints for blocking light
    4. Marking inks in the nature of printing inks for use in the process of producing printed circuit boards
    5. Marking inks for use in the process of producing electronic components
    6. Inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards
    7. Paints for sealing electronic components
    8. Heat-resistant paints
    9. Paints
    10. Printing inks for use in the process of producing printed circuit boards
    11. Printing inks for use in the process of producing electronic components
    12. Printing ink
    13. All aforementioned goods not for use as security features in identity and security documents.
  • The mark was filed in class 17 with following description of goods:
    1. Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards
    2. Insulating resin materials for use in the process of producing printed circuit boards
    3. Insulating resin materials for use in the process of producing electronic components
    4. Insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards
    5. Insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components
    6. Insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards
    7. Insulating resin materials for interlayer dielectric materials for sealing electronic components
    8. Insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards
    9. Insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components
    10. Insulating coating materials for use in the process of producing printed circuit boards
    11. Insulating coating materials for use in the process of producing display panels
    12. Insulating coating materials for protecting copper foil on the surface of printed circuit boards
    13. Insulating coating materials for use in the process of producing package application boards
    14. Insulating coating materials for use in the process of producing flexible printed circuit boards
    15. Insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards
    16. Insulating materials for sealing electronic components
    17. Insulating resin materials for sealing electronic components
    18. Electrical insulating materials for use in the process of producing printed circuit boards
    19. Semi-processed plastics
    20. Thermally conductive insulating resin materials for electronic components
    21. All aforementioned goods not for use as security features in identity and security documents.