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EUTM file information

018653418

SPS SEMICONDUCTOR PRODUCTION SYSTEMS


February 13, 2022

Trademark Summary

The trademark application SPS SEMICONDUCTOR PRODUCTION SYSTEMS was filed by SPS Group B.V., a corporation established under the laws of the Kingdom of the Netherlands (the "Applicant"). The application was published for oppositions on March 31, 2022, and it was registered by office on July 8, 2022 without any oppositions.

It was designated 'Basic Application' for International Application 1684985 at the World Intellectual Property Organization (WIPO).

The application was filed in English (French was selected as the second language).

Change of name and professional address of the trademark registration was recorded on May 24, 2022. Change of name and address of the trademark registration was recorded on September 11, 2022. Change of name and professional address of the trademark registration was recorded on March 25, 2024.


Goods And Services

  • The mark was filed in class 7 with following description of goods:
    1. Machines and apparatus for manufacturing, customizing, (lithographic) treatment, coating, cleaning, printing and packaging of semiconductors, integrated circuits and printed circuit
    2. Semiconductor wafer processing equipment
    3. Spin-coaters, namely machines to spread uniform films on flat substrates by centrifugal force
    4. Lithographic printing machines
    5. Machines and precision engineering apparatus for manufacturing and processing electronic, micromechanical and optical components
    6. Hotplates (lithographic hot plates) being parts of machines
    7. Direct laser writing devices (lithographic printing machines)
    8. UV printing machines
    9. Wafer edge grinders
    10. Cleaning and drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers.
  • The mark was filed in class 9 with following description of goods:
    1. Semiconductors
    2. Integrated circuits
    3. Optical and electronic apparatus for manufacturing, processing and testing electronic, micromechanical and optomechanical components
    4. Optical and electronic apparatus for manufacturing semiconductor and micromechanical components, in particular mask adjustment apparatus, wafer samplers, bonders, coaters, wafer abraders
    5. Sputter coaters for electron microscopy sample preparation
    6. Computer hardware.
  • The mark was filed in class 11 with following description of goods:
    1. Apparatus and installations for heating, cooling and cleaning purposes
    2. Thermal evaporator machines
    3. Drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers
    4. Wet process systems for electrochemical deposition and surface preparation applications, namely, drying apparatus for chemical processing
    5. Wafer transporters and reactors, photoresist processors, namely, hot plate ovens for heating a silicon wafer
    6. Computer software.
  • The mark was filed in class 20 with following description of goods:
    1. Packaging containers not of metal
    2. Containers, not of metal, for storage or transport
    3. Wafer shipping box
    4. Transport pallets, not of metal.
  • The mark was filed in class 37 with following description of goods:
    1. Installation of industrial machinery
    2. Semiconductor wafer machinery installation
    3. Spincoater machinery installation
    4. Restoration, repair and maintenance of semiconductor wet processing equipment and spincoaters
    5. And the re-manufacture and restoration of refurbished owned semiconductor wet processing equipment and spincoaters
    6. Wet clean upgrades, namely services for semiconductor wet cleaning and wafer cleaning.
  • The mark was filed in class 40 with Custom wafer polishing services and custom manufacture of spincoaters, wafer equipment, wafer automation and wet bench automation..
  • The mark was filed in class 42 with following description of goods:
    1. Electrical and mechanical engineering services
    2. Technical research
    3. Artificial intelligence, design, and development services in the field of silicon wafers, wafer automation, semiconductors, thin-films, spin-coaters
    4. Providing consulting services for the design of measurement systems, wetprocess equipment and apparatus, thermal evaporator systems, atomic layer deposition systems, photolithography systems
    5. Technical engineering
    6. Engineering testing
    7. Design and development of computer software in the field of wafer machinery management and optimisation.