018677458

TSMC FinFlex

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March 23, 2022

Trademark Summary

The trademark application TSMC FinFlex was filed by Taiwan Semiconductor Manufacturing Co., Ltd., a corporation established under the laws of Taiwan, Republic of China (the "Applicant"). The application was published for oppositions on April 7, 2022, and it was registered by office on July 15, 2022 without any oppositions.

The application was filed in English (French was selected as the second language).

Change of name and address of the trademark registration was recorded on June 14, 2022. Change of name and professional address of the trademark registration was recorded on January 3, 2024.

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Goods And Services

• The mark was filed in class 40 with Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
• The mark was filed in class 42 with Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits.