018836873

TDK TECHNO EXPERIENCE

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February 22, 2023

Trademark Summary

The trademark application TDK TECHNO EXPERIENCE was filed by TDK KABUSHIKI KAISHA (TDK CORPORATION), a corporation established under the laws of Japan (the "Applicant"). The application was published for oppositions on August 15, 2023, and it was registered by office on November 22, 2023 without any oppositions.

The application was filed in English (German was selected as the second language).

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Goods And Services

• The mark was filed in class 9 with following description of goods:
  
  1. Capacitors, inductors (coils)
  2. EMC (electromagnetic compatibility) components
  3. RF/SAW (radio frequency/surface acoustic wave) components and modules
  4. Voltage protection devices
  5. Current protection devices
  6. Temperature protection devices
  7. Sensors and sensor systems
  8. Ceramic switching apparatus
  9. Ceramic heating elements
  10. Piezoelectric components and buzzers
  11. Transformers
  12. Ferrites and accessories
  13. Noise suppressing/magnetic sheets
  14. Anechoic chambers and radio wave absorbers
  15. Power supplies
  16. Magnets
  17. Flash data storage devices
  18. Wireless chargers
  19. FA (factory automation) systems
  20. ITO (indium tin oxide) transparent conductive film
  21. Micro modules (substrates with built-in ICs [integrated circuits])
  22. HDD (hard disk drive) head
  23. Lithium polymer batteries
  24. Solar cells
  25. Semiconductor embedded in substrate
  26. Circuit boards
  27. Printed circuit boards
  28. Electronic circuit boards
  29. Integrated circuit boards
  30. Semiconductor boards
  31. Circuit embedded boards
  32. Printed circuit embedded boards
  33. Electronic circuit embedded boards
  34. Integrated circuit embedded boards
  35. Semiconductor embedded boards
  36. Passive component embedded boards
  37. Circuit substrates
  38. Printed circuit substrates
  39. Electronic circuit substrates
  40. Integrated circuit substrates
  41. Semiconductor substrates
  42. Circuit embedded substrates
  43. Printed circuit embedded substrates
  44. Electronic circuit embedded substrates
  45. Integrated circuit embedded substrates
  46. Semiconductor embedded substrates
  47. Passive component embedded substrates
  48. Circuit modules
  49. Printed circuit modules
  50. Electronic circuit modules
  51. Integrated circuit modules
  52. Electronic circuit cards
  53. Integrated circuit cards
  54. Electronic circuit packages
  55. Integrated circuit packages
  56. Parts and fittings for electric and electronic apparatus, namely, modules incorporated into radio frequency circuits, electrical power supplies, integrated circuits and capacitors
  57. Semiconductors
  58. Electronic integrated circuits
  59. Integrated circuits
  60. Large scale integrated circuits
  61. Printed circuits
  62. Capacitors
  63. Multilayer ceramic capacitors
  64. Ceramic capacitors
  65. Super low distortion multilayer capacitors
  66. Variable capacitors
  67. High voltage capacitors
  68. Monolithic ceramic capacitors
  69. Double layer capacitors
  70. Trimmer capacitors
  71. Electric resistors
  72. Transistors
  73. Lithium-ion batteries
  74. Solid-State Batteries
  75. Biosensors
  76. Computer software for processing vital data
  77. Wireless vital data monitoring sensors
  78. IC chips for wireless vital data monitoring sensors
  79. Portable vital data monitoring devices with sensors to monitor the vital signs, body temperatures or physical movements of persons wearing or carrying the devices and transmit these data to smart-phones or tablet computers (excluding those for medical use)
  80. IC chips for portable vital data monitoring devices
  81. Computer software for portable vital data monitoring devices
  82. Transparent conductive film
  83. Transparent conductive plates
  84. Film solar cells.