The trademark application Multi-Die-Integration Alliance was filed by SAMSUNG ELECTRONICS CO., LTD., a corporation established under the laws of the Republic of Korea (the "Applicant"). The application was published for oppositions on September 20, 2023, and it was registered by office on December 28, 2023 without any oppositions.
The application was filed in English (Italian was selected as the second language).
Change of name and address of the trademark registration was recorded on December 20, 2023. Change of name and address of the trademark registration was recorded on January 17, 2024. Change of name and address of the trademark registration was recorded on March 3, 2024. Change of name and address of the trademark registration was recorded on April 7, 2024.
Goods And Services
The mark was filed in class 9 with following description of goods:
Semi-conductors
Optical semiconductors
Semiconductor devices
Semiconductor component
Semiconductor elements
Semiconductor wafers
Electronic semi-conductors
Integrated circuits
Chips [integrated circuits]
Wafers for integrated circuits
Solid state drives
Semi-conductor memories.
The mark was filed in class 40 with following description of goods:
Semiconductor foundry
Processing of semiconductors
Custom manufacturing and assembling services relating to semi-conductor parts and integrated circuits
Semiconductor and integrated circuit foundry
Processing of integrated circuits
Processing of semiconductor elements
Processing of semiconductor wafers
Custom manufacture of semiconductor wafers
Processing of semiconductor equipment and parts
Processing and assembly of semiconductors
Processing of parts for semiconductor manufacturing
Custom assembling of circuit board and semiconductor.
The mark was filed in class 42 with following description of goods:
Design of semiconductors
Design of semiconductors or integrated circuits
Product research/custom design and testing for new product development regarding semiconductors
Technical research in the field of semiconductor design
Technical research in the field of semiconductor manufacturing