The trademark application GENPACK was filed by Materion Corporation, a U.S. corporation (the "Applicant"). The application was published for oppositions on January 7, 2024, and it was registered by office on April 15, 2024 without any oppositions.
The application was filed in English (Spanish was selected as the second language).
Goods And Services
The mark was filed in class 9 with following description of goods:
Radio frequency housings for electronic devices, namely, semiconductors, electronic chips, substrates, and radio frequency power transistors
Housings for electronic chips, substrates, and radio frequency power transistors
Semiconductor housings, namely, housings for radio frequency power transistors and radio frequency semiconductors
Radio frequency housings for 5G cellular network technology applications, electronic devices, namely, semiconductors, electronic chips, substrates, and radio frequency power transistors and 5G cellular network technology electronics.