018935294

STPay-Topaz

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October 8, 2023

Trademark Summary

The trademark application STPay-Topaz was filed by STMicroelectronics International N.V., a corporation established under the laws of the Kingdom of the Netherlands (the "Applicant"). The application was published for oppositions on January 9, 2024, and it was registered by office on April 17, 2024 without any oppositions.

The application was filed in English (French was selected as the second language).

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Goods And Services

• The mark was filed in class 9 with following description of goods:
  
  1. Chips [integrated circuits]
  2. Electric or electronic components, namely semiconductors
  3. Electronic circuits
  4. Microcircuits
  5. Integrated circuits
  6. Smart integrated circuits
  7. Integrated circuits chips
  8. Printed electronic circuits for integrated circuit apparatus and cards bearing integrated circuits
  9. Electrical or electronic circuits, namely protection circuits
  10. Electric or electronic components, namely semiconductors related to contactless payment solution
  11. Electric or electronic components, namely chips [integrated circuits] related to contactless payment
  12. Electric or electronic components, namely semiconductors related to contactless financial transactions
  13. Electric or electronic components, namely chips [integrated circuits] related to contactless financial transactions
  14. Electric or electronic components, namely chips [integrated circuits]
  15. Near-field communication technology chips [integrated circuits]
  16. Near-field communication technology chips [integrated circuits] used in the field of contactless payment solution
  17. Near-field communication technology chips [integrated circuits] used in the field of contactless financial transactions
  18. Near-field communication technology chips [integrated circuits] used in the field of mobile ticketing
  19. Cryptography software
  20. Secure integrated circuits
  21. Software solution in the field of contactless financial transactions
  22. Software solution in the field of contactless payment solution
  23. Software
  24. Application software, software applications.
• The mark was filed in class 42 with following description of goods:
  
  1. Engineering services in the field of contactless payment solution
  2. Engineering services in the field of financial transactions
  3. Design of chips [integrated circuits] for others
  4. Design of chips [integrated circuits] related to contactless payment solution
  5. Design of near-field communication technology chips [integrated circuits]
  6. Design of software solutions in the field of contactless payment solution
  7. Data encryption services.