EUTM file information

019112693

Cooling


November 27, 2024

Trademark Summary

The trademark application Cooling was filed by XMEMS Labs, Inc, a U.S. corporation (the "Applicant"). Application filed.

The application was filed in English (French was selected as the second language).


Goods And Services

  • The mark was filed in class 9 with following description of goods:
    1. Audio amplifiers
    2. Audio and visual headsets for use in playing video games
    3. Audio circuit boards
    4. Audio electronic components, such as, surround sound systems
    5. Audio equipment for vehicles, such as, loudspeakers for automotive audio systems
    6. Audio equipment for vehicles, such as, stereos, speakers, amplifiers, equalizers, crossovers and speaker housings
    7. Audio headphones
    8. Audio receivers
    9. Audio speakers
    10. Audio speakers for automobiles
    11. Semiconductor chip sets
    12. Semiconductor chip sets for use in piezo MEMS speakers and valves
    13. Semiconductor chips
    14. Semiconductor devices
    15. Semiconductors
    16. Speaker microphones
    17. Valve amplifiers
    18. Automated valves for smartphones
    19. Consumer audio devices, such as, headphones, wired and wireless earbuds, and hearing aid devices
    20. Automatic valves
    21. Consumer electronic products, such as, audio amplifiers, audio speakers, audio receivers, electrical audio and speaker cables and connectors, audio decoders, video decoders, speakers, power conversion devices, power converters, and power inverters
    22. Control valves for regulating the flow of gases and liquids
    23. Electric audio playback units
    24. Electric valve actuators
    25. Electric audio playback units with lights and speakers
    26. Electronic semiconductors
    27. Electronic valves for controlling gas or fluids
    28. Electronic components in the nature of piezo MEMS speakers and valves
    29. Electronic products for the manipulation of the frequency, time, and amplitude characteristics of audio signals, such as, audio processors
    30. Pressure relief valves for consumer audio devices, such as, headphones, earbuds, and hearing aid devices
    31. Signal processors for audio speakers
    32. Electronic components in the nature of piezo MEMS for fluidic pump
    33. Consumer audio devices, namely, headphones, earbuds, and hearing aid devices
    34. Semiconductor chip sets for use in piezo MEMS fluidic pump
    35. Air quality sensor
    36. Air pump for air quality sensor
    37. Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation and micro-fluidic pumping
    38. Smartphones
    39. Tablets
    40. Virtual reality goggles
    41. Virtual reality glasses
    42. Virtual reality Headsets
    43. Augmented reality goggles
    44. Augmented reality glasses
    45. Augmented reality Headsets
    46. Laptop computers
    47. Solid state drives
    48. Wireless chargers
    49. 2D packaging
    50. 2.5D packaging
    51. 3D packaging
    52. Chip Scale Package
    53. Flat panel displays
    54. Flat panel televisions
    55. Projectors
    56. Monitors
    57. Desktop computers
    58. Computer servers
    59. Video recording devices
    60. Consumer electronics such as smartphones, TVs, monitors, projectors, game consoles
    61. Augmented virtuality devices
    62. Augmented reality devices
    63. Virtual reality devices
    64. Audiovisual devices, such as, camcorders, video recording and broadcasting devices
    65. Computing devices including computers, such as, desktops, laptops, notebooks, tablets, computer servers
    66. Audio speakers, such as standalone speakers, speaker in desktop, wireless earbuds, TWS (true wireless stereo) earbuds, OWS (open wearable stereo) wireless earbuds, headphones, hearing aids.